IGBT模塊散熱設(shè)計(jì)參考文集

提綱
一、熱設(shè)計(jì)基礎(chǔ)知識
1、熱量傳遞的三種基本方式
2、熱阻的概念
二、器件熱特性
1、認(rèn)識器件熱阻
2、典型器件封裝散熱特性
3、單板器件的散熱路徑
三、散熱器介紹
四、導(dǎo)熱介質(zhì)介紹
五、單板強(qiáng)化散熱措施
1、PWB熱特性
2、PWB強(qiáng)化散熱措施
六、單板布局原則

功率模塊及裝置的熱設(shè)計(jì)
The purpose of thermal design
The utilizations of the thermal simulation
Main purposes of thermal analysis
1.Prediction of component temperatures;
2. Design optimization for good reliability.
Methods for Heat Dissipation
How to Choose a Proper Method?
Reference for Choosing Cooling Method
Applications of Cooling Techniques
Comparison of Various Cooling Techniques
Comparison of Two-Phase Cooling
Thermal simulation
Thermal simulation (render)
Thermal simulation (render)
Thermal test
影響熱分析精度的因素

3. 艾默生電子設(shè)備的自然冷卻熱設(shè)計(jì)規(guī)范.pdf
共兩部分：

1. 電子設(shè)備的自然冷卻熱設(shè)計(jì)規(guī)范
2. 電子設(shè)備的強(qiáng)迫風(fēng)冷熱設(shè)計(jì)規(guī)范
目錄 ................................................................................................................................... 3
前言 ................................................................................................................................... 5
1目的 ................................................................................................................................ 6
2 適用范圍 ....................................................................................................................... 6
3 關(guān)鍵術(shù)語 ....................................................................................................................... 6
4引用/參考標(biāo)準(zhǔn)或資料 ................................................................................................... 7
5 規(guī)范內(nèi)容 ....................................................................................................................... 7
5.1 遵循的原則 ................................................................................................................ 7
5.2 產(chǎn)品熱設(shè)計(jì)要求 ........................................................................................................ 8
5.2.1產(chǎn)品的熱設(shè)計(jì)指標(biāo) .................................................................................................. 8
5.2.2 元器件的熱設(shè)計(jì)指標(biāo) ............................................................................................. 8
5.3 系統(tǒng)的熱設(shè)計(jì) ............................................................................................................ 9
5.3.1 常見系統(tǒng)的風(fēng)道結(jié)構(gòu) ............................................................................................. 9
5.3.2 系統(tǒng)通風(fēng)面積的計(jì)算 ........................................................................................... 10
5.3.3 戶外設(shè)備(機(jī)柜)的熱設(shè)計(jì) ................................................................................... 11
5.3.3.1 太陽輻射對戶外設(shè)備(系統(tǒng))的影響 ................................................................ 11
5.3.3.2 戶外柜的傳熱計(jì)算 ............................................................................................ 13
5.3.4 系統(tǒng)前門及防塵網(wǎng)對系統(tǒng)散熱的影響 ............................................................... 15
5.4 模塊級的熱設(shè)計(jì) ...................................................................................................... 15
5.4.1 模塊損耗的計(jì)算方法 ......................................................................................... 15
5.4.2 機(jī)箱的熱設(shè)計(jì) ....................................................................................................... 15
5.4.2.1 機(jī)箱的選材 ........................................................................................................ 15
5.4.2.2 模塊的散熱量的計(jì)算 ........................................................................................ 15
5.4.2.3 機(jī)箱輻射換熱的考慮 ........................................................................................ 16
5.4.2.4 機(jī)箱的表面處理 ................................................................................................ 17
5.5 單板級的熱設(shè)計(jì) ...................................................................................................... 17
5.5.1 選擇功率器件時(shí)的熱設(shè)計(jì)原則 ........................................................................... 17
5.5.2 元器件布局的熱設(shè)計(jì)原則 ................................................................................... 17
5.5.3 元器件的安裝 ....................................................................................................... 18
5.5.4 導(dǎo)熱介質(zhì)的選取原則 ........................................................................................... 19
5.5.5 PCB板的熱設(shè)計(jì)原則 ........................................................................................... 20
5.5.6 安裝PCB板的熱設(shè)計(jì)原則 ................................................................................. 22
5.5.7 元器件結(jié)溫的計(jì)算 ............................................................................................... 22
5.6 散熱器的選擇與設(shè)計(jì) .............................................................................................. 23
5.6.1散熱器需采用的自然冷卻方式的判別 ................................................................ 23
5.6.2 自然冷卻散熱器的設(shè)計(jì)要點(diǎn) ............................................................................... 23
5.6.3 自然冷卻散熱器的輻射換熱考慮 ....................................................................... 24
5.6.4 海拔高度對散熱器的設(shè)計(jì)要求 ........................................................................... 24
5.6.5 散熱器散熱量計(jì)算的經(jīng)驗(yàn)公式 ........................................................................... 25
5.6.6強(qiáng)化自然冷卻散熱效果的措施 ............................................................................ 25
6 產(chǎn)品的熱測試 ............................................................................................................ 25
6.1 進(jìn)行產(chǎn)品熱測試的目的 .......................................................................................... 25
6.1.1熱設(shè)計(jì)方案優(yōu)化 .................................................................................................... 26
6.1.2熱設(shè)計(jì)驗(yàn)證 ............................................................................................................ 26
6.2熱測試的種類及所用的儀器、設(shè)備 ....................................................................... 26
6.2.1溫度測試 ................................................................................................................ 26
7 附錄 ............................................................................................................................. 27
7.1 元器件的功耗計(jì)算方法 .......................................................................................... 27
7.2 散熱器的設(shè)計(jì)計(jì)算方法 .......................................................................................... 29
7.3自然冷卻產(chǎn)品熱設(shè)計(jì)檢查模板 ............................................................................... 30

4. 電子設(shè)備熱設(shè)計(jì)規(guī)范.pdf

1．目的及適用范圍
2． 引用標(biāo)準(zhǔn)
3． 相關(guān)術(shù)語的定義
4． 電子設(shè)備熱設(shè)計(jì)的指標(biāo)要求
5． 電子設(shè)備熱設(shè)計(jì)的流程
6． 熱設(shè)計(jì)的基本理論及基本原則
7．熱設(shè)計(jì)方法之一—熱分析計(jì)算
8 熱設(shè)計(jì)方法之二—熱仿真